PCBA Capability Built for Robotics, Medical & Instrumentation
Send us your Gerber and BOM — we return a fully assembled, tested board. Below is the full technical envelope we operate inside, from bare-board fabrication and fine-pitch BGA assembly to in-house AOI / X-ray / ICT / FCT. Engineer-to-engineer, no MOQ games.
Four Service Blocks — One Integrated Workflow
We deliver every stage under one roof, so you don’t coordinate between a fab house, a sourcing agent and an assembly shop.
PCB Fabrication
Bare-board manufacturing across the full technology range used by our robotics, medical and instrumentation clients.
- 1–20 layers, FR-4, HDI, aluminum MCPCB
- Flex and rigid-flex circuits
- Impedance-controlled builds
- HASL / ENIG / Immersion Silver / OSP finishes
Component Sourcing & BOM
Full turnkey BOM procurement with qualified alternative sourcing that reduces costs and lead times — 100% guaranteed to match the original design.
- Authorized-distributor-first policy
- Qualified alternatives — cost-down & lead-time optimized, 100% design-matched
- Consigned, partial-turnkey and full-turnkey
- Component lot & date-code traceability
SMT + Through-Hole Assembly
Mixed-technology assembly on calibrated SMT lines, from 0201 passives to fine-pitch BGA.
- 0201 to BGA, fine-pitch, QFN/LGA
- Lead-free & leaded processes
- Selective & wave soldering for THT
- Double-sided & reflow + wave mixed builds
Testing & Box-Build
Inspection and functional validation before shipment, plus system-level integration when you need the final product, not just a board.
- AOI, SPI, X-ray for hidden joints
- ICT & Functional Test (FCT)
- IC programming & firmware flashing
- Cable, enclosure & full box-build
The Specs Your Design Engineers Need
Use these three tables as a first-pass feasibility check across fabrication, assembly and testing. If your design sits outside these ranges, we’ll still review — many edge cases are achievable with additional process steps.
1PCB Fabrication
| Parameter | Capability |
|---|---|
| Layer count | 1 – 20 layers (standard); higher on request |
| Board materials | FR-4, High-Tg FR-4, Aluminum MCPCB, Polyimide (flex), Rogers on request |
| Board thickness | 0.4 – 3.2 mm |
| Min. trace / space | 3 mil / 3 mil (0.075 / 0.075 mm) |
| Min. mechanical drill | 0.2 mm |
| Min. laser drill (HDI) | 0.1 mm |
| Copper weight | 0.5 oz – 4 oz (heavier on request) |
| Surface finish | HASL, Lead-free HASL, ENIG, Immersion Silver, Immersion Tin, OSP |
| Solder mask colors | Green, Black, White, Red, Blue, Yellow, Matte variants |
| Impedance control | ±10% (standard), ±5% on request |
| Max. board size | 600 × 1200 mm (single panel) |
2PCB Assembly (SMT + THT)
| Parameter | Capability |
|---|---|
| Component packages | 0201 – BGA, QFN, LGA, CGA, CSP, POP, µBGA |
| Min. BGA pitch | 0.3 mm fine-pitch |
| Min. chip component | 01005 on request / 0201 standard |
| Assembly technology | SMT, Through-Hole, Press-fit, Mixed, Double-sided |
| Soldering processes | Lead-free reflow, leaded reflow, wave, selective |
| Assembly standards | IPC-A-610 Class 2 (standard) / Class 3 (on request) |
| Wire bonding | Standard workmanship per IPC-J-STD-001 |
| Max. assembled board size | 460 × 560 mm |
| Min. assembled board size | 10 × 10 mm |
| Placement accuracy | ±25 µm (chip), ±40 µm (fine-pitch) |
| Monthly capacity | 3M+ placements / month |
3Testing & Inspection
| Inspection / Test | Coverage & Notes |
|---|---|
| SPI (Solder Paste Inspection) | Post-printing, 100% inline coverage on SMT lines |
| AOI (Automated Optical Inspection) | Post-reflow on both sides, dual-lane capable |
| X-Ray Inspection | BGA, QFN and hidden-joint verification |
| ICT (In-Circuit Test) | Bed-of-nails fixtures on customer request |
| FCT (Functional Circuit Test) | Custom fixture design; we can build the fixture for you |
| IC Programming | JTAG, ICSP, bench & in-circuit firmware flashing |
| Burn-in & Environmental | Temperature / humidity stress for motion-critical boards |
| Traceability | Lot & date-code logging, laser serial marking on request |
| First-Article Inspection | Full dimensional + visual FAI report before production release |
Beyond Standard PCBA
When your design pushes past standard FR-4 + 0402 territory, these are the advanced capabilities we routinely execute for robotics, medical and instrumentation clients.
Laser-drilled blind / buried vias, stacked and staggered via structures, any-layer HDI on request.
Polyimide flex circuits, 2–8 layer rigid-flex, wearable and instrumentation cable-replacement builds.
0.3 mm pitch BGA placement, X-ray verified. Proven on SoC and FPGA-based designs.
Up to 4 oz standard (heavier on request). Power-electronics and motor-drive boards for robotics.
Impedance-controlled stackups for low-noise analog, high-speed digital and RF front-end assemblies.
MCPCB (aluminum-core) boards for LED, motor control and heat-sensitive instrumentation loads.
High-reliability workmanship for medical and mission-critical boards, on customer request.
Enclosure assembly, cable harness integration, labeling and final packaging ready for your end-customer.
The Shop Floor Behind Your Board
Calibrated SMT lines and inspection stations for consistent quality on prototypes and pilot runs alike.
Prototype, Pilot or Production — Same Team, Same Quality
No MOQ. No volume discrimination. The same engineers review your 5-piece prototype and your 5,000-piece production run.
- Full DFM review before we quote
- Direct engineer communication, no sales queue
- Ideal for first-article and design validation
- Pilot-run optimized cost structure
- Component alternative sourcing assistance
- Full AOI, X-ray and FCT coverage
- Dedicated production line scheduling
- Lot & date-code traceability
- Release-to-ship inspection protocol
| Service | Standard Lead Time | Express Option |
|---|---|---|
| Bare PCB fabrication | 5 – 7 working days | 48 – 72 hours |
| Turnkey PCBA (prototype) | 7 – 12 working days after parts on hand | 5 working days |
| Small-batch PCBA | 2 – 3 weeks | On request |
| Medium-volume PCBA | 3 – 5 weeks | On request |
| DFM review & quote turnaround | Within 24 hours | Same-day for complete file packs |
Everything Your Board Needs After SMT
Ship a complete, field-ready product — not just a populated PCB.
Three Verticals We Know Deeply
Each vertical gets a tuned workflow: EMC-focused testing for robotics, Class 3 workmanship for medical, low-noise handling for instrumentation. Read the full scope on the About page.
What to Prepare for a Fast, Accurate Quote
Complete file packs get quoted within 24 hours. Missing files trigger one round of engineer-to-engineer clarification before we proceed.
From Your Design File to Delivered Board
Ready to Get a Quote on Your Board?
Share your Gerber and BOM — we’ll return a full quote plus DFM feedback within 24 hours. Talk to a real engineer on WhatsApp, or drop an email directly to our team.
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